AuSn20 is a kind of functional eutetic solder alloy, it has the
advantages like high thermal conductivity, tensile strength, high
shear strength, excellent wettability, without flux, creep. At the
same time, high melting point, slight changes on alloy composition
can effect the melting point, and it's expensive, these factors
restrict the development and application of the technology.
Leadao can achieve the eutectic AuSn20 electrodeposition with
specified content and specified thickness at the specified
location. Our technology is suitable for micro-size processing,
instead of preformed sheet.
1. AuSn20 is an electronic packaging materials with high thermal
conductivity, high reliability.
2. The deposition of AuSn20 can be processed in any area.
3. The deposition of AuSn20 can be processed in any thickness.