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Single/Double Copper-Plating on Ceramic Substrates (alumina)

Single/Double Copper-Plating on Ceramic Substrates (alumina)

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Use the inorganic ceramic material of aluminum oxide, aluminum nitride and beryllium oxide as insulating layer, copper, silver and gold as the conductive material, we prepared monolayer or multilayer circuit board applicated in electronic packaging.
Features of alumina ceramic:
1. Instead of direct bonded copper (DBC) process
2. Aluminum oxide substrate is of high reliability, high thermal conductivity
3. With excellent mechanical strength, tensile strength which can be over 5 N per square millimeter.
4. For its low processing cost, it can be suitable for commercial promotion.
Process Data:
1. Substrate material
Ingredient: Aluminum Oxide Al2O3>96.0 (wt%)
Thickness: 1.00, 0.76, 0.63, 0.5, 0.38, 0.25 (mm)
Density: 3.78 (g/cm3)
Coefficient of thermal conductivity(25 º C): >20 (W/m*k)
Bending Strength: >400 (MPa)
Dielectric strengths: 9.8
Breakdown voltage: 20 (kv/mm)
Volume resistivity(25 º C, minimum): 1.0E+14 (Ω*cm)
2. Plating film
Material: Pure copper/Pure gold
Thickness: 0.40, 0.30, 0.25, 0.10 (mm)
3. Substrate function
Maximum size: 5.5*7.5 (inch)
Maximum available area: 5*7 (inch)
Minimum line distance: 0.05 (mm)
Minimum line width: 0.5(mm)
Coefficient of thermal expansion: 7.4E-6 (1/K)
Peel strength of copper layer: >5 (N/mm)
Weldability: >95%
Surface status: OSP/ENIG

Product Tags:

Single/Double Copper-Plating

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